Manufacture of solid oxide electrochemical device involves disposing electrolyte between electrodes, sequentially applying bonding and sealing agents between electrode and interconnect, arranging another interconnect, and heating

摘要

An electrolyte (18) is disposed between electrodes (14,16). A bonding agent and a sealing agent are sequentially applied between electrode (14) and interconnect (20). An interconnect (26) is arranged adjacent to electrode (16). The interconnects (20,26), electrodes (14,16), electrolyte, and bonding and sealing agents are heated to at least one intermediate temperature, and then to curing temperature. The electrode (14) is bonded and sealed to the interconnect (20), and solid oxide electrochemical device is manufactured. An electrolyte (18) is disposed between electrodes (14,16). A bonding agent is applied between electrode (14) and interconnect (20), such that the bonding agent is in contact with the electrode (14) and interconnect (20). The electrode (14) and interconnect (20) are configured to form at least one flow field between each other. A sealing agent is applied between electrode (14) and interconnect (20). An interconnect (26) is arranged adjacent to electrode (16). The interconnects (20,26), electrodes (14,16), electrolyte, bonding agent and sealing agent are heated to at least one intermediate temperature for at least one intermediate length of time, and then to a curing temperature for a curing time. The electrode (14) is bonded and sealed to the interconnect (20), and solid oxide electrochemical device is manufactured. The intermediate temperature is less than the curing temperature. An independent claim is included for solid oxide electrochemical device.