Device for scoring semi-conductor wafers or similar substrates has precision drive which is connected with force transducer which is mechanically coupled with scoring tool holder guided in axial direction in damping element

摘要

The device has a precision drive which is connected with the force transducer (2) which is mechanically coupled with a scoring tool holder (6) guided in a axial direction in a damping element. The diamond (8) is adjustably fixed at the free end of the scoring tool holder in a variable adjustable angle over the semi-conductor wafers.