CONDUCTIVE RESIN COMPOSITION FOR COMPONENT FOR SEMICONDUCTOR CONVEYING VESSEL, AND COMPONENT FOR SEMICONDUCTOR CONVEYING VESSEL AND SEMICONDUCTOR CONVEYING VESSEL USING IT

摘要

PROBLEM TO BE SOLVED: To provide a component for semiconductor conveying vessel, especially a conductive resin composition suitable for a bottom plate, which has superior electrical conductivity and rigidity, and planarity reduced in warpage and anisotropy caused by a difference of mold shrinkage factors between a flow direction and a vertical direction, and wherein particles are hardly generated.;SOLUTION: This invention provides the conductive resin composition for a component for a semiconductor conveying vessel constituted by compounding (a) a thermoplastic resin by 50-80 parts by weight, (b) conductive carbon black by 5-25 parts by weight and (c) a glass reinforced filling material by 15-25 parts by weight [provided that (a)+(b)+(c)=100 parts by weight] as main components, and further provides the component for the semiconductor conveying vessel and the semiconductor conveying vessel using it.;COPYRIGHT: (C)2008,JPO&INPIT