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AGING TREATMENT METHOD AND AGING TREATMENT EQUIPMENT

机译:时效处理方法及时效处理设备

摘要

PROBLEM TO BE SOLVED: To sharply decrease failure incidence, after mounting of a chip, by obtaining progress of aging and applying appropriate treatment.;SOLUTION: The aging treatment equipment comprises a heater 2, a probe 4 conducting to a chip 1 and constant-current sources 5a, 5b, a change-over switch 7 for switching the current to the chip 1, in the order of an aging current Ie, feeble current Im, heating current Ih, and the feeble current Im, an amplifier 8, an S/H circuit section 9 and an A/D converter 10 for detecting the inter-electrode voltage of the chip 1, and a control section 11 that executes calculations. The chip 1 is heated by means of the heater 2 and after the aging current Ie is fed to the chip 1 under this state, the feeble current Im is fed to the chip 1 and the inter-electrode voltage Vm1 of the chip 1 is detected. Subsequently, the heating current Ih is fed to the chip 1, and the current to the chip 1 is returned to the feeble current Im, before the inter-electrode voltage Vm2 of the chip 1 is detected. The control section 11 executes operation, based on the Vm1 and Vm2 and determines the quality of the chip 1.;COPYRIGHT: (C)2008,JPO&INPIT
机译:要解决的问题:在芯片安装后,通过获取时效进展并进行适当的处​​理,以大大降低故障发生率;解决方案:时效处理设备包括加热器2,与芯片1导电的探头4以及电流源5a,5b,用于按照老化电流Ie,微弱电流Im,加热电流Ih和微弱电流Im的顺序切换到芯片1的电流的转换开关7,放大器8,S / H电路部分9和用于检测芯片1的电极间电压的A / D转换器10,以及执行计算的控制部分11。通过加热器2加热芯片1,并且在该状态下将老化电流Ie馈送到芯片1之后,将微弱的电流Im馈送到芯片1,并且检测到芯片1的电极间电压Vm1。 。随后,在检测到芯片1的电极间电压Vm2之前,将加热电流Ih馈送到芯片1,并且将流向芯片1的电流返回至微电流Im。控制部分11基于Vm1和Vm2执行操作并确定芯片1的质量。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008166319A

    专利类型

  • 公开/公告日2008-07-17

    原文格式PDF

  • 申请/专利权人 VICTOR CO OF JAPAN LTD;

    申请/专利号JP20060350793

  • 发明设计人 OMACHI OSAMU;SUGAWARA TAKASHI;

    申请日2006-12-27

  • 分类号H01S5/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:37

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