SYSTEM-IN-PACKAGE SEMICONDUCTOR DEVICE SUITABLE FOR EFFICIENT POWER MANAGEMENT, AND POWER MANAGEMENT METHOD

摘要

PPROBLEM TO BE SOLVED: To provide a system-in-package semiconductor device suitable for efficient power management, and a power management method. PSOLUTION: The system-in-package semiconductor device comprises a plurality of chips including first and second chips. Each of the chips includes an alive block continuously supplied with power so as to be continuously in an on state; a local interface part 221 transmitting data transmitted from the inside of the chip, to other chips or receiving data transmitted from other chips; and an IP (intellectual property) block 231 designed to have independent functions for storing and processing data. The alive blocks of the plurality of chips are connected to each other through a first signal line part for transmitting a signal required to wake up or initialize the chips. The alive blocks 211 control power supply to all the chips in response to external wake-up instructions or a signal transmitted through the first signal line part. PCOPYRIGHT: (C)2008,JPO&INPIT