FILM TEMPORARY APPLYING APPARATUS AND FILM TEMPORARY APPLYING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a film temporary applying apparatus for temporarily applying a film to a printed circuit board without wrinkling the same.;SOLUTION: The film temporary applying apparatus 10 is constituted so as to temporarily apply a pair of wound films F to both sides of the printed circuit board W in a predetermined length. A temporary applying member 2 has an adsorbing part 21 for adsorbing and holding the leading end side of the film F and a temporary applying part 22 for allowing the leading end of the film F to approach one end of the printed circuit board W to temporarily apply the same to the film F. A chuck 3 has a grasping part 32 for grasping the leading end part and one end of the printed circuit board W. The chuck 3 moves the printed circuit board W in the applying direction of the film F. The temporary applying part 22 of the temporary applying member 2 has plurality of the intermittent recesses 22a opposed to the leading end of the film F and the grasping part 32 of the chuck 3 has a plurality of the intermittent protrusions 321 having access to a plurality of the intermittent recesses 22a to come into contact with the leading end of the film F.;COPYRIGHT: (C)2008,JPO&INPIT