THERMAL INFRARED SOLID-STATE IMAGE PICKUP DEVICE AND INFRARED CAMERA

摘要

PROBLEM TO BE SOLVED: To provide an infrared solid-state image pickup device which suppresses occurrence of fluctuation and noise caused by temperature and is less in sensitivity unevenness.;SOLUTION: The infrared solid-state image pickup device includes a pixel area in which infrared detection pixels are arranged and an integration circuit which modulates output current based on pixel output. The integration circuit 108 includes an integration transistor 203 which modulates current by potential difference between first and second current fixation means, integral capacity 211 which accumulates the modulated current and is periodically reset, a transistor 206 for supplying bias current, a switch 209 which connects between a drain and a gate of the transistor 206 for supplying bias current, capacity 210 which performs AC coupling between an output point of an integration transistor and the integral capacity, a gate bias switch 204 which supplies bias voltage to the integration transistor, a switch 201 which switches potential input from the first and second current fixation means to the integration transistor and capacity 202 which performs AC coupling between the switch and a gate of the integration transistor.;COPYRIGHT: (C)2009,JPO&INPIT