首页> 外国专利> HYDROPHOBIC POLYMER, LAMINATED FORM WITH ELECTRICALLY CONDUCTIVE FILM USING THE SAME, METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE PATTERN, PRINTED WIRING BOARD UTILIZING THE LAMINATED FORM, THIN-LAYER TRANSISTOR, AND DEVICE EQUIPPED WITH THEM

HYDROPHOBIC POLYMER, LAMINATED FORM WITH ELECTRICALLY CONDUCTIVE FILM USING THE SAME, METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE PATTERN, PRINTED WIRING BOARD UTILIZING THE LAMINATED FORM, THIN-LAYER TRANSISTOR, AND DEVICE EQUIPPED WITH THEM

机译:疏水性聚合物,具有相同导电膜的叠层形式,生产导电图案的方法,利用叠层形式的印刷线路板,薄层晶体管以及配备有该装置的设备

摘要

PROBLEM TO BE SOLVED: To provide a new hydrophobic polymer suitable for forming an electrically conductive pattern on a silicon oxide-based substrate such as glass by electroless plating technique, to provide, using the hydrophobic polymer, a laminated form with an electrically conductive film of high adhesiveness on a substrate, to provide a method for forming the laminated form, to provide a printed wiring board having the electrically conductive film as wiring, to provide a thin-film transistor, and to provide a device equipped with them.;SOLUTION: The new hydrophobic polymer includes a radical-polymerizable unsaturated moiety and a moiety to be adsorbed with an electroless plating catalyst, wherein the constitutive ratio for both of the above moieties is (60:40) to (30:70). The laminated form with its surface provided with an electrically conductive film is obtained by binding the hydrophobic polymer to a polymerization initiation layer to form a graft polymer layer, which is then imparted with an electroless plating catalyst to conduct an electroless plating.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种新的疏水性聚合物,其适合通过化学镀技术在基于氧化硅的基板(例如玻璃)上形成导电图案,以使用该疏水性聚合物提供具有导电膜的层压形式在基材上具有高粘合性,提供一种形成叠层形式的方法,提供一种具有导电膜作为布线的印刷线路板,提供一种薄膜晶体管,并提供一种配备有它们的器件。新型疏水聚合物包括可自由基聚合的不饱和部分和将被化学镀催化剂吸附的部分,其中上述两个部分的本构比为(60:40)至(30:70)。表面具有导电膜的叠层形式是通过将疏水性聚合物与聚合引发层结合形成接枝聚合物层而得到的,然后将其与化学镀催化剂一起进行化学镀。 C)2008,日本特许厅

著录项

  • 公开/公告号JP2008088273A

    专利类型

  • 公开/公告日2008-04-17

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20060270035

  • 发明设计人 MATSUSHITA YASUAKI;

    申请日2006-09-29

  • 分类号C08F8/00;C23C18/18;C08F299/00;H05K3/18;H01L21/288;H01L21/28;H01L21/3205;C08F220/10;C08F220/54;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:01

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