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GOLD POWDER FOR GOLD CLAY, AND GOLD CLAY COMPRISING THE GOLD POWDER

机译:用于金泥的金粉,以及包含金粉的金泥

摘要

PROBLEM TO BE SOLVED: To obtain a dense sintered compact even if a molding produced using gold clay comprising gold powder in this invention is fired at a relatively low temperature, and further, to allow the surface of the sintered compact to exhibit the gloss characteristic of gold by a polishing operation in a relatively short time.;SOLUTION: The gold powder for gold clay is composed of a mixture of first gold grains with the average grain diameter of 1 to 30 nm by 1 to 30 wt.% and second gold grains with the average grain diameter of 0.1 to 30 μm by 99 to 70 wt.%. The second gold grains are composed of either or both of the small-sized grains with the average grain diameter of 0.1 to 2 μm and the large-sized grains with the average grain diameter of 2 to 30 μm.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:即使在相对较低的温度下烧制本发明的使用包含金粉的金粘土制备的模制品,也可以获得致密的烧结体,并且使烧结体的表面呈现出光泽特性。解决方案:用于金粘土的金粉由平均粒径为1至30 nm的1至30 wt%的第一金晶粒和第二金晶粒的混合物组成其平均粒径为0.1至30μm×99至70重量%。第二金晶粒由平均粒径为0.1至<2μm的小粒径和平均粒径为2至30μm的大粒径中的任一个或全部组成。 :(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008038205A

    专利类型

  • 公开/公告日2008-02-21

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20060214598

  • 发明设计人 OGAWA REIKO;HIGAMI AKIHIRO;

    申请日2006-08-07

  • 分类号B22F1/00;B22F3/02;A44C27/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:22:58

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