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TEMPERATURE CYCLE TEST DEVICE AND TEMPERATURE CYCLE TEST METHOD

机译:温度循环试验装置及温度循环试验方法

摘要

PROBLEM TO BE SOLVED: To perform a test in a test environment where the influence of the moisture absorption and dehydration of polyimide resin by moisture in the atmosphere is minimized when the temperature cycle test is applied to an electronic component.;SOLUTION: The electronic component 1, a cooling furnace 2, a heating furnace 3, an electronic component holding section 4, a movement mechanism 5, and the like are arranged in a chamber 9. A movement control controller 6, a temperature sensor 7, an electrical characteristic sensor 8, a hygrometer 12, and the like are disposed around the chamber 9. A temperature cycle test for recognizing the durability against the temperature difference of the electronic component is performed. At this time, the humidity environment of the electronic component in the chamber 9 is controlled to humidity 10% RH (temperature 25°C) or lower. By removing air from the inside of the chamber 9 and filling nitrogen gas, moisture absorption and dehydration phenomenon is prevented.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:要在测试环境中进行测试,当将温度循环测试应用于电子部件时,聚酰亚胺树脂的水分吸收和脱水对大气中水分的影响会降至最低;解决方案:电子部件如图1所示,在腔室9内配置有冷却炉2,加热炉3,电子部件保持部4,移动机构5等。移动控制控制器6,温度传感器7,电气特性传感器8。在腔室9的周围配置有湿度计12,湿度计12等。进行用于确认针对电子部件的温度差的耐久性的温度循环试验。此时,将腔室9中的电子部件的湿度环境控制为湿度10%RH(温度25℃)或更低。通过从腔室9内部除去空气并填充氮气,防止了水分的吸收和脱水现象。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008076224A

    专利类型

  • 公开/公告日2008-04-03

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO LTD;

    申请/专利号JP20060255663

  • 发明设计人 NAGAI HIDEYUKI;

    申请日2006-09-21

  • 分类号G01R31/26;G01R31/00;H01F41/00;H01G13/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:22:44

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