首页> 外国专利> SHAPE PROCESSING CONTROL TECHNOLOGY FOR LOCALLY REMOVING AND CUTTING CARBON NANO MATERIAL BY ELECTRON BEAM, AND APPARATUS THEREFOR

SHAPE PROCESSING CONTROL TECHNOLOGY FOR LOCALLY REMOVING AND CUTTING CARBON NANO MATERIAL BY ELECTRON BEAM, AND APPARATUS THEREFOR

机译:电子束局部去除和切割碳纳米材料的形状加工控制技术及装置

摘要

PROBLEM TO BE SOLVED: To provide a technology and an apparatus capable of locally removing and cutting a carbon nano material in an arbitrary position by using electron beams by means of the introduction of a carbon reactive gas, thereby processing the carbon nano material into an arbitrary shape.;SOLUTION: In the technology and the apparatus, the carbon nano material is processed into the arbitrary shape by introducing the gas containing an atom reactive with carbon atom, scanning the electron beams, whose acceleration voltage and irradiation current are adjusted, on the arbitrary position of the carbon nano sample placed in a working section to locally irradiate the carbon nano material in the state of controlling the gas introducing quantity by a controller and controlling the position of a gas nozzle for introducing the gas into the working section by a control stage, thereby locally destructing the atomic bonding structure of the carbon nano material to locally remove and cut the carbon nano material.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种技术和设备,该技术和设备能够通过引入碳反应性气体,通过使用电子束在任意位置局部地去除和切割碳纳米材料,从而将碳纳米材料加工成任意形状。解决方案:在该技术和设备中,通过将含有与碳原子反应的原子的气体引入到碳纳米材料上,然后扫描电子束,以调整其加速电压和照射电流,从而将碳纳米材料加工成任意形状。放置在工作区中的碳纳米样品的任意位置,以在通过控制器控制气体引入量和通过控制装置控制将气体引入工作区的气体喷嘴位置的状态下局部照射碳纳米材料。阶段,从而局部破坏碳纳米材料的原子键合结构,以局部去除和切割碳纳米材料。碳纳米材料。;版权所有:(C)2008,日本特许厅&INPIT

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