首页> 外国专利> PLATING METHOD AND PATTERNING METHOD ON METAL-CERAMIC COMPOSITE MEMBER, WET TREATMENT APPARATUS AND METAL-CERAMIC COMPOSITE MEMBER FOR POWER MODULE

PLATING METHOD AND PATTERNING METHOD ON METAL-CERAMIC COMPOSITE MEMBER, WET TREATMENT APPARATUS AND METAL-CERAMIC COMPOSITE MEMBER FOR POWER MODULE

机译:功率模块用金属陶瓷复合构件,湿法处理设备和金属陶瓷复合构件的镀覆方法和构图方法

摘要

PROBLEM TO BE SOLVED: To increase working efficiency and reduce cost by saving labor for masking at plating.;SOLUTION: The back surface of a metal-ceramic composite member 4 is integrated with a base 1, and the side of the metal-ceramic composite member 4 to which a metal plate 3 is bonded is covered by a frame-like masking member 20 having an aperture 21 corresponding to a portion to be plated on the metal plate 3. The aperture 21 is sealed by firmly bonding its periphery to the metal-ceramic composite member 4. While supporting the metal plate 3 in a state of facing down, the under side surface of the metal-ceramic composite member 4 contacts with a plating solution 110 through the masking member 20 to perform the plating of the portion to be plated on the metal plate 3.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:通过节省电镀时的掩膜劳动来提高工作效率并降低成本。解决方案:金属陶瓷复合材料构件4的背面与基底1集成在一起,金属陶瓷复合材料的侧面与金属板3结合的金属构件4被框状的遮盖构件20覆盖,该金属掩膜构件20具有与要在金属板3上镀覆的部分相对应的孔21。陶瓷复合材料构件4。金属陶瓷复合材料构件4的下侧面在以向下的状态支撑金属板3的状态下,通过掩膜构件20与镀敷液110接触,进行镀敷处理。镀在金属板上3 .;版权所有:(C)2008,JPO&INPIT

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