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METHOD FOR PRODUCTION OF SEMICONDUCTOR SINGLE CRYSTAL USING CZOCHRALSKI METHOD, AND SEMICONDUCTOR SINGLE CRYSTAL INGOT AND WAFER PRODUCED BY THE METHOD
METHOD FOR PRODUCTION OF SEMICONDUCTOR SINGLE CRYSTAL USING CZOCHRALSKI METHOD, AND SEMICONDUCTOR SINGLE CRYSTAL INGOT AND WAFER PRODUCED BY THE METHOD
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机译:用直拉法生产半导体单晶的方法,以及用该方法生产的半导体单晶硅片和晶片
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摘要
PROBLEM TO BE SOLVED: To provide a method for production of a semiconductor single crystal using the Czochralski method in which productivity is improved compared with a conventional one, by expanding the specific resistance profile along the longitudinal direction of a crystal to increase the prime length of the single crystal, and to provide a semiconductor single crystal ingot produced by the method and a wafer prepared from the ingot.;SOLUTION: A seed crystal is immersed in the melt SM of a semiconductor raw material and a dopant material contained in a crucible 10, and then a semiconductor single crystal C is grown by gradually pulling the seed crystal upward while rotating. In this case, the specific resistance profile which is theoretically calculated along the longitudinal direction of the crystal C by applying to the crucible, a cusp asymmetric magnetic field in which the magnetic field intensity at an upper part is different from that at a lower part is expanded along the longitudinal direction of the crystal C using the ZGP (Zero Gauss Plane) in which the vertical component of the magnetic field is zero as a basis.;COPYRIGHT: (C)2008,JPO&INPIT
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