Being the hole vacant wiring backing material for the semiconductor equipment internal multilayer interconnection substrate and the wiring backing material where conductor wiring was formed to the semiconductor equipment

摘要

PROBLEM TO BE SOLVED: To provide a wiring substrate, a multi-layer wiring board incorporating a semiconductor device, which, when a plurality of wiring substrates containing the semiconductor device mounted thereon are stacked and integrally fused, can avoid generation of a wiring distortion or deformation in the semiconductor device itself or between the semiconductor and the wiring substrate, can avoid generation of a defect including a wiring failure such as open- or short-circuiting, can prevent formation of a void and therefore prevent reduction of a moisture absorption reflow heat resistance, thus achieving a fine wiring pitch in a three-dimensional mounting module, realizing a stable operational characteristic of the semiconductor device or the wiring substrate, and enhancing the reliability of the semiconductor device or the wiring substrate; and to provide a method for manufacturing the wiring board.;SOLUTION: When a plurality of wiring substrates including a semiconductor device mounted thereon are stacked and integrally fused, a perforated wiring substrate 3 having an opening 16 formed therein for accommodating the semiconductor device is used, the planar shape of the opening 16 not having 5 or more recesses 10.;COPYRIGHT: (C)2005,JPO&NCIPI