首页> 外国专利> METHOD OF MANUFACTURING INSULATION LAYER BASE MATERIAL WITH CONDUCTOR LAYER, AND INSULATION LAYER BASE MATERIAL WITH CONDUCTOR LAYER OBTAINED BY THE METHOD

METHOD OF MANUFACTURING INSULATION LAYER BASE MATERIAL WITH CONDUCTOR LAYER, AND INSULATION LAYER BASE MATERIAL WITH CONDUCTOR LAYER OBTAINED BY THE METHOD

机译:用导体层制造绝缘层基体材料的方法,以及用该方法制得的具有导体层的绝缘层基体材料的方法

摘要

PPROBLEM TO BE SOLVED: To provide a method of manufacturing an insulation layer base material with a conductor layer, and the insulation layer base material with the conductor layer obtained thereby, capable of manufacturing, in a simple way, a laminated body having a conductor layer which is excellent in adhesiveness with an insulation film and less in irregularities in a boundary face with the insulation film. PSOLUTION: This method of manufacturing the insulation layer base material with the conductor layer comprises a step of forming a chemical active spot generating layer interacting with an insulation layer (b), on one side or both sides of an insulation layer base material having electrical insulation properties with the insulation layer as a base material (a), a step of forming a reactive high polymer compound-bearing layer interacting with the chemical active spot generating layer (c) and the conductor layer, on a surface of the chemical active spot generating layer, and a step of forming the conductor layer (d) by adding conductive material, or the like to high polymer compound contained in the reactive high polymer compound-bearing layer (c). PCOPYRIGHT: (C)2008,JPO&INPIT
机译:

要解决的问题:提供一种制造具有导体层的绝缘层基材的方法,以及由此获得的具有导体层的绝缘层基材,其能够以简单的方式制造具有以下特征的层压体:导体层,其与绝缘膜的密合性优异,与绝缘膜的界面的凹凸少。

解决方案:该具有导体层的绝缘层基材的制造方法包括以下步骤:在绝缘层基材的一侧或两侧上形成与绝缘层(b)相互作用的化学活性点产生层。绝缘层作为基材(a)具有电绝缘性的步骤,是在化学药品的表面上形成与化学活性点产生层(c)和导体层相互作用的反应性高分子化合物承载层的步骤活性点产生层,以及通过将导电材料等添加到反应性高分子化合物承载层(c)中所含的高分子化合物中而形成导体层(d)的步骤。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2008108469A

    专利类型

  • 公开/公告日2008-05-08

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20060287941

  • 发明设计人 TSURUMI MITSUYUKI;

    申请日2006-10-23

  • 分类号H01B13;H05K3;H05K1/03;B32B7/02;B32B15/08;H01B5/14;C08J7/04;

  • 国家 JP

  • 入库时间 2022-08-21 20:20:06

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