{VinylPolymersencapsulatingsemiconductornanoparticles, mixturescontainingthesame, andmanufacturingmethodthereof} its manufacturing method with a mixture containing the same and semiconductor nanoparticles capsule vinyl polymer

摘要

Provided is a semiconductor nanoparticle-encapsulating vinyl polymer including vinyl polymer particles; and semi-conductor nanoparticles, uniformly dispersed in the vinyl polymer particles, having an average particle size of 1 to 150 nm, wherein the semiconductor nanoparticles are encapsulated by the vinyl polymer particles. Provided is also a mixture of the semiconductor nanoparticle-encapsulating vinyl polymer with a commercially available vinyl polymer. In the nanoparticle-encapsulating vinyl polymer and the mixture, since the semiconductor nanoparticles are encapsulated by the vinyl polymer particles, they are highly dispersed even in vinyl polymer products. Therefore; an aggregation phenomenon of semi-conductor nanoparticles that may be caused by physical mixing of semiconductor nanoparticles and a commercially available vinyl polymer can be prevented, thereby remarkably increasing a reduction in dioxin emission during incineration of the wastes of vinyl polymer products. Furthermore, the semiconductor nanoparticles of the semiconductor nanoparticle-encapsulating vinyl polymer can remarkably increase photodegradation efficiency due to the photocatalytic activity of the nanoparticles. In addition, the semiconductor nanoparticles of the semiconductor nanoparticle-encapsulating vinyl polymer can serve as fillers, thereby enhancing mechanical properties such as tensile strength and modulus of elasticity without lowering impact strength. In particular, in a flexible poly vinylchloride compound manufactured using semiconductor nanoparticles-encapsulating polyvinylchloride and a commercially available phthalate-based low-molecular weight liquid phase plasticizer, a plasticizer migration phenomenon can be prevented by adsorptivity of highly dispersed semiconductor nanoparticles.