Integrated parallel Peltier-Seebeck element chip and a manufacturing method thereof, and an integrated Peltier-Seebeck element panel or sheet, as well as direct energy conversion systems and energy transfer system,

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for producing a multitude of integrated parallel Peltier-Seebeck element chips simultaneously.;SOLUTION: A first conductive member and a second conductive member, having different Seebeck coefficient, are formed on an insulating substrate and these are connected through an ohmmic contact and the surface connected through the ohmmic contact are covered by the plate of a material, excellent in thermal conductivity and provided with electric insulation on the surfaces connected by the ohmmic contact or an aluminum plate, for example, provided with the electrical insulation on the surface thereof through alumite processing or the like. Then, bonding wires are connected to first and second conductive members on the opposite side through the ohmmic contact, to insulate the bonding wires from each other and obtain the output terminal of integrated parallel Peltier-Seebeck element chip. The energy converting device from electricity into heat as well as the heat energy transfer device are obtained by connecting a plurality of integrated parallel Peltier-Seebeck element chips produced in such a manner by serial or parallel cables.;COPYRIGHT: (C)2006,JPO&NCIPI