首页> 外国专利> The compound dielectric material, the compound dielectric moldings, and the glass lens antenna, and use this the surface implemental die antenna null dielectric inorganic

The compound dielectric material, the compound dielectric moldings, and the glass lens antenna, and use this the surface implemental die antenna null dielectric inorganic

机译:复合电介质材料,复合电介质成型件和玻璃透镜天线,并使用该表面工具芯片天线将电介质无机化

摘要

PROBLEM TO BE SOLVED: To provide a composite dielectric material, a composite dielectric molding superior in antenna gain and appropriate for a lens antenna and a surface mounted antenna or the like, wherein characteristic fluctuations in an individual and between individuals are small.;SOLUTION: This is the composite dielectric material containing a dielectric inorganic filler and organic polymer materials, and the dielectric inorganic filler is composed of high dielectric constant ceramic powders whose dielectric constant is 104 to 180 and low dielectric constant ceramic powders whose dielectric constant is 6 to 18, and which is characterized by that the average particle diameter of the low dielectric constant ceramic powders is 0.27 to 125 times of that of the high dielectric constant ceramic powders.;COPYRIGHT: (C)2004,JPO
机译:要解决的问题:为了提供一种复合介电材料,一种复合介电模制件,其天线增益优异并且适用于透镜天线和表面安装天线等,其中个体之间以及个体之间的特性波动很小。这是一种包含介电无机填料和有机聚合物材料的复合介电材料,介电无机填料由介电常数为104至180的高介电常数陶瓷粉和介电常数为6至18的低介电常数陶瓷粉组成,其特征在于:低介电常数陶瓷粉的平均粒径是高介电常数陶瓷粉的0.27〜125倍。;版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP4020000B2

    专利类型

  • 公开/公告日2007-12-12

    原文格式PDF

  • 申请/专利权人 株式会社村田製作所;

    申请/专利号JP20030112192

  • 发明设计人 桜田 清恭;

    申请日2003-04-16

  • 分类号H01B3/00;H01Q13/08;H01Q15/08;H01Q19/06;

  • 国家 JP

  • 入库时间 2022-08-21 20:18:13

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