To possess with the expedient (20) which makes the aforementioned block move

摘要

PROBLEM TO BE SOLVED: To offer a wafer notch polishing machine which is a comparatively simple polishing machine for polishing a notch in a wafer and which can polish an orientation notch in a silicon wafer by an economical method, and additionally which is available as an independent unit or a first station of a polishing machine and a wafer grinding.;SOLUTION: This notch polishing machine employs a plurality of polishing tapes (12) which can be sequentially introduced into the notch (11) of a wafer (10) to polish both sides of the notch (11), i.e., the top and bottom surfaces. Meanwhile, the wafer (10) is moved in lateral direction of X-direction and/or Y-direction regarding the tape (12). Each tape (12) is pulled off a supply reel (66) and passed into a mounting block (41) sized to fit into the wafer notch (11). Each block (41) is mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in a common position to be pivoted between a position angularly disposed relative to the top of the wafer (10) and a position angularly disposed relative to the bottom of the wafer (10).;COPYRIGHT: (C)2002,JPO