Phenolic hydroxyl group the chemical compound which 2 or more it possesses the accelerator which (A) and

摘要

PROBLEM TO BE SOLVED: To provide a curing agent composition capable of providing good curability, flowability and shelf life to an epoxy resin composition, the epoxy resin composition with good characteristics, and a semiconductor device excellent in solder crack resistance and moistureproof reliability.;SOLUTION: The curing agent composition for epoxy resins comprises a compound (A) having two or more phenolic hydroxy groups in a molecule and a curing accelerator (B) represented by general formula (1), and is produced by heating and mixing 2-50 pts.wt. of the component (B) into 100 pts.wt. of the component (A) at a temperature of the softening point of the component (A) or higher. In general formula (1), Ar¹, Ar² and Ar³ denote each a substituted or unsubstituted monovalent aromatic group, and may be the same as or different from each other; and Ar⁴ denotes a divalent aromatic group which is substituted with a substituent other than a hydroxy group or unsubstituted.;COPYRIGHT: (C)2004,JPO