首页> 外国专利> Sinterring the Sb-Te based alloy powder and this powder for sinterring, production method of the sintered body sputtering target and the Sb-Te based alloy powder for sinterring which can

Sinterring the Sb-Te based alloy powder and this powder for sinterring, production method of the sintered body sputtering target and the Sb-Te based alloy powder for sinterring which can

机译:可以烧结Sb-Te系合金粉末和该烧结用粉末,烧结体溅射靶的制造方法以及可以烧结的Sb-Te系合金粉末。

摘要

Furthermore the machine pulverizing the gas atomization powder of the Sb-Te based alloy, sinterring the Sb-Te based alloy powder and this powder which for sinterring, feature that maximum grain size of the powder which can is 90 millimicrons or less maximum grain size of the powder is 90 millimicrons or less by the machine pulverizing in inactive atmosphere without it makes the atomization powder the sintered body sputtering target which can and after melting the Sb-Te based alloy, with gas atomization, furthermore, disclosing this to the atmosphere, the Sb-Te based alloy powder for the sintered body sputtering target which features that the powder which at the same time makes oxygen content decrease is producedProduction method. Uniformity and refinement of Sb-Te based alloy sputtering target organization are assured, crack initiation of the sinterring target is controlled, occurrence of akingu is prevented at the time of sputtering. In addition, unevenness of the surface by the spatter erosion is made to decrease, the Sb-Te based alloy sputtering target of satisfactory quality is obtained.
机译:此外,将Sb-Te基合金的气体雾化粉末粉碎的机器,将Sb-Te基合金粉末和该用于烧结的粉末烧结,其特征在于,所述粉末的最大晶粒尺寸可以为90微米或更小。粉末是通过在惰性气氛中粉碎而不使雾化粉末成为烧结体溅射靶的方式在不活泼的气氛中粉碎为90毫微米或更小,该烧结体溅射靶可以并且在将Sb-Te基合金熔化后通过气体雾化将其公开到大气中,生产用于烧结体溅射靶的Sb-Te系合金粉末,其特征在于,该粉末同时降低氧含量。确保了Sb-Te基合金溅射靶组织的均匀性和细化度,控制了烧结靶的裂纹萌生,并且在溅射时防止了烧焦的发生。另外,通过飞溅腐蚀减少了表面的不均匀性,获得了质量令人满意的Sb-Te基合金溅射靶。

著录项

  • 公开/公告号JPWO2006077692A1

    专利类型

  • 公开/公告日2008-08-07

    原文格式PDF

  • 申请/专利权人 日鉱金属株式会社;

    申请/专利号JP20060553829

  • 发明设计人 高橋 秀行;

    申请日2005-11-29

  • 分类号C23C14/34;C22C1/04;B22F9/04;B22F9/08;C22C12/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:17:38

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号