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The poly hydroxy poly ether resin constituent and hardening resin and the resin equipped metallic foil which contain the said poly hydroxy poly ether resin, resin film
The poly hydroxy poly ether resin constituent and hardening resin and the resin equipped metallic foil which contain the said poly hydroxy poly ether resin, resin film
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机译:包含上述聚羟基聚醚树脂的聚羟基聚醚树脂组成物,固化性树脂和带有树脂的金属箔,树脂膜
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摘要
PROBLEM TO BE SOLVED: To provide a resin composition for improving productivity of multilayer printed wiring board, and capable of giving an ultrathin resin film having heat resistance and storage stability or a resin coated metal foil with adhesive.;SOLUTION: The thermoplastic polyhydroxypolyether resin composition comprises (A) 10-50 wt.% of a thermoplastic polyhydroxypolyether resin component and (B) 90-50 wt.% of a mixed solvent component, and the polyhydroxypolyether resin has 250-400 g/eq of hydroxy equivalent, 20-30 wt.% of halogen content and 10,000-200,000 of average molecular weight and the mixed solvent component (B) comprises three or more kinds of organic solvents having different vapor pressure and the mixed solvent manifests 2,000 hPa of vapor pressure at 100°C.;COPYRIGHT: (C)2003,JPO
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机译:解决的问题:提供一种树脂组合物,其用于提高多层印刷线路板的生产率,并且能够提供具有耐热性和储存稳定性的超薄树脂膜或具有粘合剂的树脂涂覆的金属箔。包含(A)10-50 wt。%的热塑性聚羟基聚醚树脂组分和(B)90-50 wt。%的混合溶剂组分,并且聚羟基聚醚树脂的羟基当量为250-400 g / eq,20-30卤素含量的重量百分比和平均分子量为10,000-200,000,混合溶剂组分(B)包含三种或更多种具有不同蒸气压的有机溶剂,并且该混合溶剂在100℃时表现出<2,000 hPa的蒸气压。 ;版权:(C)2003,日本特许厅
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