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SYSTEM AND APPARATUS FOR ELECTRICALLY TESTING LEAD-TO-LEAD SHORTING DURING MAGNETORESISTIVE SENSOR FABRICATION
SYSTEM AND APPARATUS FOR ELECTRICALLY TESTING LEAD-TO-LEAD SHORTING DURING MAGNETORESISTIVE SENSOR FABRICATION
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机译:磁阻传感器制造过程中电测试铅对铅短路的系统和装置
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摘要
Built-in electrical test structures are measured for lead-to-lead shorting during the fabrication of MR elements on a wafer. The test structures are fabricated in the same fashion as the MR elements, however, the active sensor region or track width is omitted from the test structures. Thus, the left and right leads for each test structure are electrically isolated from each other in their “track width” region. If there is lead-to-lead shorting on a test structure, then the left and right leads are electrically connected in the track width region. A simple resistance measurement between the left and right leads determines the extent of any lead shorting by giving a quantitative resistance value.
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