LED epiwafer pad manufacturing process amp; new construction thereof

摘要

A pad manufacturing process applied in LED epiwafer and a new construction thereof comprising of a means to increase interfacial bonding strength being provided first to the surface of the epiwafer; followed with a metal deposition means provided to the surface of the epiwafer by having the surface processed with plasma to improve adhesion between pad and epiwafer; and plating conditions being controlled to obtain finer and more uniform grains to correct the problem of pad surface roughness in order to improve the bonding strength between pad and bonding wire. Furthermore, a new construction of epiwafer and a pad is comprised of an epiwafer containing a substrate, an epitaxial layer, and a first metal layer covering the top of the epitaxial layer; an adhesion layer covering the top of the first metal layer; and a pad covering the top of the adhesion layer in sequence.