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Micro-Fluid Ejection Head with Embedded Chip on Non-Conventional Substrate
Micro-Fluid Ejection Head with Embedded Chip on Non-Conventional Substrate
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机译:非常规基板上带有嵌入式芯片的微流体喷射头
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摘要
Micro-fluid ejection heads and methods for fabricating the same. One such micro-fluid ejection head includes a substrate having a plurality of fluid ejection actuator devices adjacent to a device surface thereof A valley is adjacent to the device surface of the substrate. A semiconductor chip is associated with the plurality of fluid ejection actuator devices. The chip is in the valley adjacent the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate. The deposited conductive material generally conforms to the valley. The conductive material is in electrical flow communication with the chip.
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