首页> 外国专利> Micro-Fluid Ejection Head with Embedded Chip on Non-Conventional Substrate

Micro-Fluid Ejection Head with Embedded Chip on Non-Conventional Substrate

机译:非常规基板上带有嵌入式芯片的微流体喷射头

摘要

Micro-fluid ejection heads and methods for fabricating the same. One such micro-fluid ejection head includes a substrate having a plurality of fluid ejection actuator devices adjacent to a device surface thereof A valley is adjacent to the device surface of the substrate. A semiconductor chip is associated with the plurality of fluid ejection actuator devices. The chip is in the valley adjacent the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate. The deposited conductive material generally conforms to the valley. The conductive material is in electrical flow communication with the chip.
机译:微流体喷射头及其制造方法。一个这样的微流体喷射头包括基板,该基板具有在其装置表面附近的多个流体喷射致动器装置。凹谷与基板的装置表面相邻。半导体芯片与多个流体喷射致动器装置相关联。芯片位于与衬底的器件表面相邻的凹处。邻近衬底的器件表面沉积导电材料。沉积的导电材料通常顺应波谷。导电材料与芯片电流连通。

著录项

  • 公开/公告号US2008079780A1

    专利类型

  • 公开/公告日2008-04-03

    原文格式PDF

  • 申请/专利权人 ZHIGANG XIAO;

    申请/专利号US20060551457

  • 发明设计人 ZHIGANG XIAO;

    申请日2006-10-20

  • 分类号B41J2/05;

  • 国家 US

  • 入库时间 2022-08-21 20:13:38

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