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Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material

机译:Ai / Ain接头材料,电源模块基板,电源模块以及Ai / Ain接头材料的制造方法

摘要

A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.
机译:用于功率模块的基板包括:金属板,接合至金属板的陶瓷基板以及设置在金属板与陶瓷基板之间的接合表面中的脱模剂。脱模剂的残留量小于通过荧光X射线分析测得的硼的量的5,并且接合表面中的晶粒应变区域等于或小于40%,或者晶粒应变的量接合面中的α≤0.03%。

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