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DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS PACKAGES
DIRECT LIQUID JET IMPINGEMENT MODULE FOR HIGH HEAT FLUX ELECTRONICS PACKAGES
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机译:用于高热通量电子封装的直接液体射流冲击模块
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摘要
A direct liquid jet impingement module and associated method of providing such used in cooling of electronic components housed in an electronic package is provided. The module comprises a frame having an orifice to be placed over to-be-cooled components. A manifold is then disposed over the frame, such that the manifold opening is aligned with the frame orifice to ultimately enable fluid impingement on the to-be-cooled components. The manifold is formed to receive an inlet for the flow of coolants and an outlet fitting for removal of dissipated heat. A jet orifice plate is also provided inside the manifold opening, aligned with the frame orifice for directing fluid coolant flow over to-be-cooled components.
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