RFID tag using patch antenna designs and low cost manufacturing techniques

摘要

Methods, systems, and apparatuses for improved tag assemblies, are described herein. In an aspect, a radio frequency identification (RFID) tag assembly includes an enclosure, a substrate, an antenna, an electrical circuit, and a plate. The substrate is coupled to an inner surface of the enclosure. The antenna is formed on a surface of the substrate. The electrical circuit is on the substrate and is electrically coupled to the antenna. The plate is attached to an outer surface of the enclosure and configured to be a ground plane for the antenna.