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Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
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机译：使用预图案化的可重复使用的模具制造微电子封装的方法以及该模具的制造方法
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摘要
A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.
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