Method for forming a packing for resin catalytic packed beds, and so formed packing

• 1. 印刷电路板的内置电容层形成用的含有电介质填料的树脂及用该含有电介质填料的树脂形成了电介质层的双面镀铜箔叠层板及该双面镀铜箔叠层板的制造方法 [P] . 中国专利： CN100349966C . 2007.11.21
• 2. 印刷电路板的内置电容层形成用的含有电介质填料的树脂及用该含有电介质填料的树脂形成了电介质层的双面镀铜箔叠层板及该双面镀铜箔叠层板的制造方法 [P] . 中国专利： CN1543486A . 2004-11-03
• 3. Method For Forming A Packing For Resin Catalytic Packed Beds, And So Formed Packing [P] . 美国专利： US2008089816A1 . 2008-04-17

  机译： 树脂催化填充床的填充物的形成方法以及填充物

• 4. METHOD FOR FORMING A PACKING FOR RESIN CATALYTIC PACKED BEDS, AND SO FORMED PACKING [P] . 欧洲知识产权局专利： EP1812153A1 . 2007-08-01

  机译： 形成树脂催化包装床包装的方法及类似的包装

• 5. METHOD FOR FORMING A PACKING FOR RESIN CATALYTIC PACKED BEDS, AND SO FORMED PACKING. [P] . MX2007005161A . 2007-09-11

  机译： 形成树脂催化填充床包装的方法，以及类似的包装。

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• 1. 不同碳纳米填料形成的高度取向导电网络结构的动态逾渗行为 [C] . Zhang Shuangmei ,张双梅 ,Lin Lin . 第十届全国博士生学术年会 . 2012
• 2. 随机球填料旋转填充床内气液流动过程的CFD模拟研究 [A] . 王佳琦 . 2020