GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH INITIAL BONDING CAPABILITY, HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY, HIGH RESIN FLOW RESISTANCE AND LOW SPECIFIC RESISTANCE

摘要

ABSTRACT There are provided a gold alloy wire for a bonding wirehaving high initial bonding ability, high bondingreliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, highresin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100ppm in total, if necessary, and a balance being Au and inevitable impurities.