首页> 外国专利> LOW COST FOOD PROCESSING, PREPARATION, AND HANDLING DEVICES MANUFACTURED FROM CONDUCTIVE LOADED RESIN- BASED MATERIALS

LOW COST FOOD PROCESSING, PREPARATION, AND HANDLING DEVICES MANUFACTURED FROM CONDUCTIVE LOADED RESIN- BASED MATERIALS

机译:使用导电负载树脂基材料制造的低成本食品加工,制备和处理设备

摘要

Food processing, preparation, and handling devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or :by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
机译:食品加工,制备和处理设备由导电的,基于树脂的材料制成。负载有导电树脂的材料在基础树脂主体中包含微米级导电粉末,导电纤维或导电粉末与导电纤维的组合。导电粉末,导电纤维或它们的组合的重量百分比在导电负载的基于树脂的材料的重量的约20%至50%之间。微米级导电粉末是金属或导电非金属或镀金属的非金属。微米导电纤维可以是金属纤维或镀金属纤维。此外,可以通过将金属镀覆到金属纤维上或通过将金属镀覆到非金属纤维上来形成镀金属纤维。任何可镀纤维都可用作非金属纤维的芯。在本发明中,超导体金属还可以用作微米级导电纤维和/或用作在纤维上的金属镀层。

著录项

  • 公开/公告号WO2005119837A3

    专利类型

  • 公开/公告日2008-02-07

    原文格式PDF

  • 申请/专利权人 INTEGRAL TECHNOLOGIES INC.;AISENBREY THOMAS;

    申请/专利号WO2005US18954

  • 发明设计人 AISENBREY THOMAS;

    申请日2005-05-31

  • 分类号A47J43/28;H01Q1/36;H01Q1/38;H01Q9/28;

  • 国家 WO

  • 入库时间 2022-08-21 20:02:42

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