Systems and methods are provided for inspecting ampoule packages for the presence of leaks. The systems and methods may be part of a manufacturing line for ampoule packages, particularly flexible ampoule cards that contain sterile pharmaceutical solutions. The solution-containing packages are compressed in an amount sufficient to cause leaking of solution from a pre-existing tear or perforation in an ampoule. The amount of compression applied is less than that required to cause significant package damage such as bursting. The packages are compressed using surfaces of sensing grids which are effective in detecting presence of a liquid outside the package during the compression. By using the conductive properties of the solution, sensing grids and appropriate circuitry can be used to signal or cause an alarm in the event a package has been determined to contain a leak.
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