PUMPING CAVITY FOR SEMICONDUCTOR SIDE PUMPING MODULE

摘要

A pumping cavity for semiconductor side pumping module comprises a heat sink body (1), a plurality of movable bodies (3) and a plurality of single emitters (4). The heat sink body (1) comprises heat sink pieces (7) and a center hole, and the heat sink pieces (7) are uniformly arranged around the center of the heat sink body (1). The movable bodies (3) are movably mounted on the heat sink pieces (7), and the single emitters (4) are mounted on the movable bodies (3). A laser crystal may be placed in the center hole of the heat sink body (1).