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E-BEAM/MICROWAVE GAS JET PECVD METHOD AND APPARATUS FOR DEPOSITING AND/OR SURFACE MODIFICATION OF THIN FILM MATERIALS
E-BEAM/MICROWAVE GAS JET PECVD METHOD AND APPARATUS FOR DEPOSITING AND/OR SURFACE MODIFICATION OF THIN FILM MATERIALS
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机译:薄膜材料的沉积和/或表面改性的电子束/微波气体喷射化学气相沉积方法和装置
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摘要
A novel high speed, high quality plasma enhanced surface modification or CVD thin-film deposition method and apparatus. The invention employs both microwave (5) and e-beam energy (6) for creation of a plasma of excited species which modify the surface of substrates (2) or are deposited onto substrates to form the desired thin film. The invention also employs a gas j et system (3) to introduce the reacting species to the plasma. This gas jet system (3) allows for higher deposition speed than conventional PECVD processes while maintaining the desired high quality of the deposited materials.
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