SOLID STATE LIGHT SOURCE MOUNTED DIRECTLY ON ALUMINUM SUBSTRATE FOR BETTER THERMAL PERFORMANCE AND METHOD OF MANUFACTURING THE SAME

摘要

In accordance with the present invention, a solid state light source packaged for high temperature operation comprises an Aluminum Metal substrate (100) including an overlying plurality of electrical circuitries (13 A-E) isolated with dielectric between the circuitry metallization and metal substrate, a light source die (18) direct mounted overlying the metal base (1 OA-D) with no dielectric (12) in between, an underlying electrical connection pads connected to the overlying electrical circuitries using vertically isolated bulk metal without drilling, an underlying electrical circuitries (13A- E) connected directly to the bulk metal (1 OA-D) with no dielectric (12) in between and an over-molded compound (33) for protection and light shaping purposes. The selective electrical isolation and direct mounting of the heat source to the bulk metal (1 OA-D) allow lowest thermal resistances. Similar design with a plurality of the same is applicable for more than one or matrix LED assembly.