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Metallic material, electroinic component, electronic device and electronic optical component manufactured by using the metallic material and working method of the metallic material

机译:使用该金属材料制造的金属材料,电子零件,电子设备以及电子光学零件及其加工方法

摘要

The metallic material consists of analloy including mainly Cu, Mo in an amount of 0.1 to 3.0% by weight and one or a plurality of elements selected from a group consisting of Al, Au, Ag, Ti, Ni Co and Si in a total amount of 0.1 to 3.0% by weight. In the metallic material, Mo is added to Cu so that Mo will be homogeneously mixed in a grain boundary of Cu, resulting in improvement of atmospheric corrosion resistance.
机译:金属材料由主要包含Cu,Mo(按重量计0.1%至3.0%)和选自Al,Au,Ag,Ti,Ni Co和Si的总量中的一种或多种元素的合金组成。 0.1至3.0重量%。在金属材料中,将Mo添加到Cu中,使得Mo将均匀地混合在Cu的晶界中,从而改善了耐大气腐蚀性。

著录项

  • 公开/公告号EP1918391A2

    专利类型

  • 公开/公告日2008-05-07

    原文格式PDF

  • 申请/专利权人 DEPT CORPORATION;

    申请/专利号EP20080150197

  • 发明设计人 UENO TAKASHI C/O DEPT CORPORATION;

    申请日2003-09-03

  • 分类号C22C9/00;C22C9/01;C22C9/06;C22C9/10;C22F1/08;C23C14/34;H01L21/28;H01L21/3205;H01L21/3213;

  • 国家 EP

  • 入库时间 2022-08-21 19:56:08

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