首页> 外国专利> PERPENDICULAR TYPE PROBE FOR TEST OF SEMICONDUCTOR, PROBE CARD WITH THE PROBES AND METHODS FOR MANUFACTURING THE PROBE CARD

PERPENDICULAR TYPE PROBE FOR TEST OF SEMICONDUCTOR, PROBE CARD WITH THE PROBES AND METHODS FOR MANUFACTURING THE PROBE CARD

机译:半导体的垂直型探头,带有该探头的探头卡以及该探头卡的制造方法

摘要

A vertical probe for inspecting a semiconductor is provided to shorten an interval of semiconductor inspection time by inspecting a semiconductor chip with an irregular two-dimensional pad arrangement at a time. A vertical probe(300) includes a front end part(310) in contact with a pad of a semiconductor chip in operation and a support part(320) that supports the front end part and gives elasticity to the front end part. The support part is made of at least one support piece. The support part can be fixed to a fixing part(330) fixed to a ceramic substrate. The front end part can include a coupling part connected to the support part and a contact part incorporated with the coupling part wherein the contact part comes in contact with the pad of the semiconductor chip in operation. The contact part can come in line-contact with the pad of the semiconductor chip.
机译:提供用于检查半导体的垂直探针,以通过一次检查具有不规则的二维焊盘布置的半导体芯片来缩短半导体检查时间的间隔。垂直探针(300)包括与操作中的半导体芯片的焊盘接触的前端部(310)和支撑前端部并赋予前端部弹性的支撑部(320)。支撑部分由至少一个支撑件制成。支撑部可以固定到固定在陶瓷基板上的固定部(330)。前端部分可以包括连接到支撑部分的结合部分和结合到结合部分中的接触部分,其中接触部分在操作中与半导体芯片的焊盘接触。接触部分可以与半导体芯片的焊盘线接触。

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