THERMALLY CURABLE COMPOSITE RESIN HAVING LOW DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS

摘要

A thermosetting composite resin composition having a low dielectric constant and a low dielectric loss is provided to be used in forming a laminate for printed circuits and to ensure transmission characteristics suitable for a high-frequency band. A thermosetting composite resin composition having a low dielectric constant and a low dielectric loss includes: a base resin obtained by mixing polyphenylene oxide with polystyrene in a weight ratio of 6:4 to 8:2; a crosslinking agent in a sufficient amount to provide a weight ratio of 1:9 to 3:7 based on the base resin; an additive in a sufficient amount to provide a weight ratio of 1:10 to 1:5 based on the base resin; and an initiator in a sufficient amount to provide a weight ratio of 1:20 to 1:5 based on the crosslinking agent.