首页> 外国专利> III-NITRIDE BASED LIGHT-EMITTING DIODE STRUCTURE WITH MONOLITHICALLY INTEGRATED SIDEWALL DEFLECTORS AND METHOD OF THEREOF

III-NITRIDE BASED LIGHT-EMITTING DIODE STRUCTURE WITH MONOLITHICALLY INTEGRATED SIDEWALL DEFLECTORS AND METHOD OF THEREOF

机译:具有整体集成的侧壁偏转器的基于III-氮化物的发光二极管结构及其制造方法

摘要

An III-nitride based light emitting diode structure and a manufacturing method thereof are provided to improve surface extraction efficiency by 2 times by forming monolithically integrated sidewall defectors through a conventional manufacturing process of LED. An LED structure has a Hi-nitride epi layer formed on a support substrate, in which angled mesa deflector is formed in a sidewall of the III-nitride epi layer and sidewall angle is between 20 degrees and 40 degrees. The support substrate is made of any one selected from the group consisting of sapphire, Si, SiC, MgAl2O4, ZnO, and MgO. The epi layer is made of any one selected from the group consisting of GaN, GaP, and GaAs. The epi layer has the structure that p-electrode is formed at the upper side of n- electrode, and the total thickness of the III-nitride thin film including the n-electrode and the p-electrode is in the range of 1 to 10 micrometers.
机译:提供一种基于III族氮化物的发光二极管结构及其制造方法,以通过常规的LED制造工艺形成单片集成的侧壁缺陷器,从而将表面提取效率提高两倍。 LED结构具有形成在支撑衬底上的高氮化物外延层,其中在III族氮化物外延层的侧壁中形成有角度的台面偏转器,并且侧壁角在20度至40度之间。支撑基板由选自蓝宝石,Si,SiC,MgAl 2 O 4,ZnO和MgO中的任何一种制成。外延层由选自GaN,GaP和GaAs的任何一种制成。外延层具有以下结构:在n电极的上侧形成p电极,并且包括n电极和p电极的III族氮化物薄膜的总厚度在1至10的范围内。千分尺。

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