首页> 外国专利> METHOD OF PHOT0-REFLECTANCE CHARACTERIZATION OF STRAIN AND ACTIVE DOPANT IN SEMICONDUCTOR STRUCTURES

METHOD OF PHOT0-REFLECTANCE CHARACTERIZATION OF STRAIN AND ACTIVE DOPANT IN SEMICONDUCTOR STRUCTURES

机译:半导体结构中应变和活性掺杂物的光反射特性表征方法

摘要

A new method of photo-reflectance characterization of strain and active dopant in semiconductor structures has been developed for characterization of physical properties of semiconductor structures. The underlying principle of the strain and active dopant characterization technique is to measure photo-reflectance signals occurring nearby to interband transitions in the semiconductor bandstructure and which are highly sensitive to strain and/or active dopant through the effect of the nanometer scale space charge fields induced at the semiconductor surface. To attain this, the present disclosure comprises an intensity modulated pump laser beam and a continuous wave probe laser beam, focused coincident on a semiconductor structure. The pump laser provides approximately 15 mW optical power in the NIR-VIS. The pump light is amplitude modulated by a signal generator operating in the range of 100kHz-50MHz. The probe beam is approximately 5 mW operating in the VIS-UV and is generally of wavelength nearby to strong optical absorptions in the semiconductor structure. The pump and probe are focused co-incident to a micrometer scale spot on the sample. Probe specular reflections are collected and the pump wavelength light is removed using a color filter. The remaining probe light is directed onto a photodiode and converted to an electrical signal. The probe AC signal then contains pump induced changes in the semiconductor material optical response. Phase sensitive measurement is performed on the photodiode output and the AC signal is divided by the DC reflectance signal. Thus photo-reflectance information is recorded as a function of probe wavelength, modulation frequency, pump intensity, and pump and probe polarizations.
机译:已经开发了用于表征半导体结构中的应变和活性掺杂剂的光反射的新方法,以表征半导体结构的物理性质。应变和活性掺杂剂表征技术的基本原理是测量光反射信号,该信号发生在半导体能带结构中的带间跃迁附近,并且通过感应产生的纳米级空间电荷场对应变和/或活性掺杂剂高度敏感在半导体表面。为了实现这一点,本公开包括强度调制的泵浦激光束和连续波探测激光束,其被重合地聚焦在半导体结构上。泵浦激光器在NIR-VIS中提供大约15 mW的光功率。泵浦光由工作在100kHz-50MHz范围内的信号发生器进行幅度调制。探测光束在VIS-UV中工作大约为5 mW,通常具有接近半导体结构中强光吸收的波长。泵和探头共同入射到样品上的微米级斑点。收集探头的镜面反射,并使用滤色镜去除泵浦波长的光。其余的探测光被引导到光电二极管上并转换为电信号。然后,探头交流信号包含泵浦引起的半导体材料光学响应的​​变化。对光电二极管输出执行相敏测量,交流信号除以直流反射率信号。因此,将光反射信息记录为探针波长,调制频率,泵浦强度以及泵浦和探针极化的函数。

著录项

  • 公开/公告号KR20080091085A

    专利类型

  • 公开/公告日2008-10-09

    原文格式PDF

  • 申请/专利权人 XITRONIX CORPORATION;

    申请/专利号KR20087012266

  • 发明设计人 CHISM WILLIAM W. II;

    申请日2008-05-22

  • 分类号G01N21/00;

  • 国家 KR

  • 入库时间 2022-08-21 19:52:53

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