Fabricating Method of Semiconductor Device Containing Both Resist Flow Process and Film-Coating Process

摘要

relates to a method for manufacturing a semiconductor device, the prey is formed a photoresist pattern on top of each layer following a pattern , the resist flow process (resist flow process) and the formation of the coating film is heated , by sequentially performing the process step of removing , using independent and uniformly reduced to obtain a photoresist pattern , and this photoresist pattern density , exposure to a method that can be used for any semiconductor manufacturing process of a fine pattern having a resolution or more devices .