首页> 外国专利> Solvent-Free Polyimide Silicone-Based Resin Composition and Resin Coat Using the Same

Solvent-Free Polyimide Silicone-Based Resin Composition and Resin Coat Using the Same

机译:无溶剂型聚酰亚胺有机硅树脂组合物和使用该组合物的树脂涂层

摘要

the invention are shown in formula (1) is a repeating unit having the polyimide silicone resin, (meth) acrylic includes compounds and polymerization initiators, and in 25 said Genie fluidity, also relates to a substantially solventless polyimide silicone resin composition characterized in that does not contain a solvent. ; & Formula 1 & ; wherein, X is a tetravalent organic group, and Y is a divalent organic group, Z is a divalent organic group having an organosiloxane structure, p and q are each a positive number a. ; polyimide silicone resin composition of the present invention, the reactive compound in the polyimide silicone resin (meth) acrylic compound used as a diluent because it is substantially omit a step of removing the solvent because they do not contain solvents can, and may also provide a high adhesion to the base material of various shapes.
机译:式(1)所示的本发明是具有聚酰亚胺硅树脂的重复单元,(甲基)丙烯酸包括化合物和聚合引发剂,并且在所述的25 Genie流动性中,还涉及一种基本上无溶剂的聚酰亚胺硅树脂组合物,其特征在于不含溶剂。 ; & <式1> ;其中,X为四价有机基团,Y为二价有机基团,Z为具有有机硅氧烷结构的二价有机基团,p和q均为正数a。 ;在本发明的聚酰亚胺硅氧烷树脂组合物中,由于在聚酰亚胺硅氧烷树脂(甲基)丙烯酸化合物中的反应性化合物由于不含溶剂而实质上省略了除去溶剂的步骤,因此可以用作稀释剂,并且还可以提供对各种形状的基材具有高附着力。

著录项

  • 公开/公告号KR100821069B1

    专利类型

  • 公开/公告日2008-04-08

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20020024912

  • 申请日2002-05-07

  • 分类号C08L83/08;

  • 国家 KR

  • 入库时间 2022-08-21 19:52:17

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