首页> 外国专利> SIP(SYSTEM-IN-PACKAGE) EMBEDDING FOLDED TYPE SP(SHORTED-PATCH) ANTENNA AND METHOD FOR DESIGNING SIP THEREOF

SIP(SYSTEM-IN-PACKAGE) EMBEDDING FOLDED TYPE SP(SHORTED-PATCH) ANTENNA AND METHOD FOR DESIGNING SIP THEREOF

机译:嵌入式折叠式sip天线的系统级封装系统及其设计方法

摘要

An SiP(System-in-Package) with a folded type SP(Shorted-Patch) antenna and a method for designing the same are provided to reduce cost and to improve performance by using a microstrip line as a feed unit of the folded type SP antenna. An SiP(400) with a folded type SP antenna(408) includes first and third layers(402,406). A second layer(404) is arranged between the first and third layers. A ground plane(410) is formed on the first and third layers. A patch(412) is formed on the second layer. A short-circuit between the ground plane and the patch is formed by a through-hole via or a via wall. The SiP further includes a feed unit(414) to feed current to the patch. The feed unit has a micro-strip line.
机译:提供了一种具有折叠式SP(缩短贴片)天线的SiP(系统级封装)及其设计方法,以通过使用微带线作为折叠式SP的馈电单元来降低成本并提高性能。天线。具有折叠型SP天线(408)的SiP(400)包括第一层和第三层(402,406)。第二层(404)布置在第一层和第三层之间。在第一和第三层上形成接地平面(410)。在第二层上形成补丁(412)。接地平面和贴片之间的短路是由通孔或通孔壁形成的。 SiP还包括用于将电流馈送到贴片的馈送单元(414)。进纸单元有一条微带线。

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