首页> 外国专利> MICROSTRIP TRANSMISSION LINE STRUCTURE AND UNEQUAL POWER DIVIDERS AND BRANCH HYBRID COUPLERS USING THE SAME

MICROSTRIP TRANSMISSION LINE STRUCTURE AND UNEQUAL POWER DIVIDERS AND BRANCH HYBRID COUPLERS USING THE SAME

机译:相同的微带传输线结构和不均等的功率分配器和分支混合耦合器

摘要

A microstrip transmission line structure and an unequal power divider and a branch hybrid coupler using the same are provided to achieve a variable division ratio by utilizing electrical characteristics of a DGS(Defected Ground Structure) through a dual microstrip dielectric substrate. A microstrip transmission line structure includes first and second dielectric substrates. The first dielectric substrate has a main body with a first surface and a second surface opposite to the first surface, a microstrip transmission line formed on the first surface, a ground layer formed on the second surface, and a DGS(164) formed on the ground layer in a size and a shape corresponding to the optimum characteristic impedance. The second dielectric substrate has a main body with a first surface and a second surface opposite to the first substrate, a second ground layer(173) formed on the second surface and a conductive layer(175) formed in a via hole passing through the main body. The second ground layer is electrically connected to the ground layer of the first dielectric substrate through the conductive layer. A first ground layer is formed on the first surface of the second dielectric substrate, overlapped with the ground layer including the DGS, and exposes some region of the first surface of the second dielectric substrate at a larger size than the DGS.
机译:提供微带传输线结构以及不等功率分配器和使用其的分支混合耦合器,以通过双微带电介质基板利用DGS(缺陷接地结构)的电特性来实现可变的分配比。微带传输线结构包括第一和第二介电基板。所述第一介电基板具有:主体,其具有第一表面和与所述第一表面相对的第二表面;微带传输线,形成在所述第一表面上;接地层,形成在所述第二表面上;以及DGS(164),其形成在所述第一介电基板上。接地层的尺寸和形状对应于最佳特性阻抗。第二介电基板具有主体,该主体具有与第一基板相对的第一表面和第二表面,形成在第二表面上的第二接地层(173)以及形成在穿过主体的通孔中的导电层(175)。身体。第二接地层通过导电层电连接到第一介电基板的接地层。第一接地层形成在第二介电基板的第一表面上,与包括DGS的接地层重叠,并且以大于DGS的尺寸暴露第二介电基板的第一表面的一些区域。

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