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REPAIR SOLDERING head with a supply channel for a heat transfer medium and with a return channel for a heat transfer medium THIS AND ITS APPLICATION
REPAIR SOLDERING head with a supply channel for a heat transfer medium and with a return channel for a heat transfer medium THIS AND ITS APPLICATION
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机译:具有用于传热介质的供应通道和用于传热介质的回流通道的修焊头这及其应用
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摘要
1. and u043fu0430u00a0u043bu044cu043du0430u00a0 head u0434u043bu00a0 component replacement (26) to the reception element (14) u0434u043bu00a0 of u0432u043fu0430u0438u0432u0430u043du0438u044e or u0432u044bu043fu0430u0438u0432u0430u043du0438u044e component (26) and a channel (18) u0434u043bu00a0 u043fu043eu0434u0432u043eu0434u00a0u0449u0438u043c u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0439 environment (16) u0434u043bu00a0 u0440u0430u0441u043fu043bu0430u0432u043bu0435u043du0438u00a0 u043fu0440u0438u043fu043eu00a0 (27) on a component (26), u043eu0442u043bu0438u0447u0430u044eu0449u0430u00a0u0441u00a0, a return channel (19) u0434u043bu00a0 liquid u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0439 environment (16).;2. and u043fu0430u00a0u043bu044cu043du0430u00a0 head on 1, u043eu0442u043bu0438u0447u0430u044eu0449u0430u00a0u0441u00a0 what return channel (19) is held in such a way that u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0430u00a0 environment (16) in the designation of the position u0446u0438u043eu043du0438u0440u043eu0432u0430u043du0438u0438 and u043fu0430u00a0u043bu044cu043du043eu0439 head during the return u043fu043eu0434u0434u0435u0440u0436u0438u0432u0430u0435u0442u0441u00a0 force u0442u00a0u0436u0435u0441u0442u0438.;3. and u043fu0430u00a0u043bu044cu043du0430u00a0 head for 1 or 2, u043eu0442u043bu0438u0447u0430u044eu0449u0430u00a0u0441u00a0, u043fu043eu0434u0432u043eu0434u00a0u0449u0438u0439 channel (18) and the return channel (19) made in the form of the internal pipe (20) and the external environment. the pipes (21).;4. and u043fu0430u00a0u043bu044cu043du0430u00a0 head on p.3, u043eu0442u043bu0438u0447u0430u044eu0449u0430u00a0u0441u00a0, u0432u043du0435u0448u043du00a0u00a0 pipe (21), a receiving element (14) is u0443u043fu043bu043eu0442u043du0438u0442u0435u043bu044cu043du0443u044e edge (28) in the direction to be i u0432u043fu0430u0438u0432u0430u043du0438u044e or u0432u044bu043fu0430u0438u0432u0430u043du0438u044e component (26).;5. and u043fu0430u00a0u043bu044cu043du0430u00a0 head on paragraph 4, u043eu0442u043bu0438u0447u0430u044eu0449u0430u00a0u0441u00a0 what reception element (14) is equipped with a suction line (31) to be u0432u043fu0430u0438u0432u0430u043du0438u044e or u0432u044bu043fu0430u0438u0432u0430u043du0438u044e u043au043eu043cu043fu043eu043du0435 u0434u043bu00a0 u043du0442u0430 (26).;6. and u043fu0430u00a0u043bu044cu043du0430u00a0 head on 1, u043eu0442u043bu0438u0447u0430u044eu0449u0430u00a0u0441u00a0 as foreseen mechanical device u0441u043eu043fu0440u00a0u0436u0435u043du0438u00a0 (13) u0434u043bu00a0 installation of selective soldering.;7. the use of maintenance u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) u0434u043bu00a0 u0432u044bu043fu0430u0438u0432u0430u043du0438u00a0 component (26) from the substrate (29) in which;- and u043fu0430u00a0u043bu044cu043du0443u044e head (12) to the reception element (14) have to be u0432u044bu043fu0430u0438u0432u0430u043du0438u044e component (26).;- u043du0430u043fu0440u0430u0432u043bu00a0u044eu0442 u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0443u044e wednesday (16) through u043fu043eu0434u0432u043eu0434u00a0u0449u0438u0439 channel (18) on a component (26) and u043eu0442u0432u043eu0434u00a0u0442 in liquid u0441u043eu0441u0442u043eu00a0u043du0438u0438 through return conduit (19), while u043fu0430u00a0u043du043eu0435 connection (27) m u0435u0436u0434u0443 component (26) and the substrate (29) u0440u0430u0441u043fu043bu0430u0432u0438u0442u0441u00a0 and;- the police component (26) by a reception element (14) to the substrate.;8. the use of maintenance u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) u0434u043bu00a0 u0443u0434u0430u043bu0435u043du0438u00a0 residual u043fu0440u0438u043fu043eu00a0 (32) u0432u044bu043fu0430u00a0u043du043du043eu0433u043e component (26), in which the;- introduce and u043fu0430u00a0u043bu044cu043du0443u044e head (12) with u043fu043eu0434u0432u043eu0434u00a0u0449u0438u043c channel (18) u0434u043bu00a0 u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0439 environment (16) to the residual u043fu0440u0438u043fu043eu044e and;- as u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0439 environment (16) u043du0430u043fu0440u0430u0432u043bu00a0u044eu0442 u043fu043eu0434u0432u043eu0434u00a0u0449u0438u0439 liquid solder through the channel (18) on the residual solder (32) and u043eu0442u0432u043eu0434u00a0u0442 in liquid u0441u043eu0441u0442u043eu00a0u043du0438u0438 through reflexive kang al (19), while the residual solder (32) u0440u0430u0441u043fu043bu0430u0432u0438u0442u0441u00a0 and u0441u0442u0435u0447u0435u0442 together with u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0439 environment (16).;9. the use of maintenance u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) u0434u043bu00a0 electoral u043eu0431u043bu0443u0436u0438u0432u0430u043du0438u00a0 installation location (33) u0434u043bu00a0 of u0432u043fu0430u0438u0432u0430u043du0438u044e component (26), in which the;- u043fu0440u0438u043fu043eu0439u043du044bu0439 material (35) u043du0430u043du043eu0441u00a0u0442 respectively subject to the location of the u043fu0430u00a0u043du044bu0445 compounds component (26) on the body (34), u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0435;- establish u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0435 body (34) to the reception element (14) and u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) and have a high u043fu0440u0438u043fu043eu0439u043du044bu0439 material (35) side at the site of the installation (33).;- u043du0430u043fu0440u0430u0432u043bu00a0u044eu0442 u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0443u044e wednesday (16) through u043fu043eu0434u0432u043eu0434u00a0u0449u0438u0439 channel (18) at the u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0435 body (34) and back to the liquid u0441u043eu0441u0442u043eu00a0u043du0438u0438 through return conduit (19), while u043fu0440u0438u043fu043eu0439u043d floor material (35) u043eu0442u0434u0435u043bu0438u0442u0441u00a0 from u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0433u043e body (34) and location (33) u043fu0435u0440u0435u043fu043bu0430u0432u0438u0442u0441u00a0 in stocks u043fu0440u0438u043fu043eu00a0 and;through the reception element (14) are u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0435 substrate body (34) without u043fu0430u00a0u043du043eu0433u043e material (35).;10. the use of maintenance u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) u0434u043bu00a0 u0432u043fu0430u0438u0432u0430u043du0438u00a0 component (26) at the place of installation (33) of the substrate (29) in which;- to be u0432u043fu0430u0438u0432u0430u043du0438u044e component housed in an element (14) and u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) and go to the place of installation (33).;- u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0443u044e wednesday (16) through u043fu043eu0434u0432u043eu0434u00a0u0449u0438u0439 channel (18) u043du0430u043fu0440u0430u0432u043bu00a0u044eu0442 component and u043eu0442u0432u043eu0434u00a0u0442 in liquid u0441u043eu0441u0442u043eu00a0u043du0438u0438 through return conduit (19), while stocks u043fu0440u0438u043fu043eu00a0 between circuits a single element (26) and the substrate (29) will be u043fu0435u0440u0435u043fu043bu0430u0432u043bu0435u043du044b in u043fu0430u00a0u043du044bu0435 u0441u043eu0435u0434u0438u043du0435u043du0438u00a0 (27), and;- the police and u043fu0430u00a0u043bu044cu043du0443u044e head (12) without component.;11. the use of maintenance u043fu0430u00a0u043bu044cu043du043eu0439 heads (12) u0434u043bu00a0 u0432u043fu0430u0438u0432u0430u043du0438u00a0 component (26) at the place of installation (33) of the substrate (29) in which;component (26) going to the place of installation (33) and retained there.;- and u043fu0430u00a0u043bu044cu043du0443u044e head (12) with u043fu043eu0434u0432u043eu0434u00a0u0449u0438u043c channel (18) u0434u043bu00a0 u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0435u0439 environment (16) moved to the product in the area of the other side (33) and the installation place;- u0442u0435u043fu043bu043eu043fu0435u0440u0435u0434u0430u044eu0449u0430u00a0 wednesday (16) through u043fu043eu0434u0432u043eu0434u00a0u0449u0438u0439 channel (18) on a substrate u043du0430u043fu0440u0430u0432u043bu00a0u0435u0442u0441u00a0 (29) and in the liquid u0441u043eu0441u0442u043eu00a0u043du0438u0438 flows through the return channel (19), while between the substrate (29) and component (26), a u043fu0430u00a0u043du043eu0435 connection.
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