High temperature resistant bismaleimide resins

摘要

High temperature-resistant, bismaleimide resin consisting of at least a bismaleimide, a alkenylphenol and at least one acrylic acid esters, characterized in that the acrylic acid esters at least one of the following compounds of the general formula i to vi represents, whereinR1, r2, r3 =, in each case, methacryloyl, acryloyl or h - atom,R4 = h - atom,R5 = hydroxyethyl, hydroxypropyl, 2 - ethylhexyl, glycidyl or a c₁- to c₁₈-Alkyl,R6 = h - atom or methyl,x, y = 0, 1, 2 or 3, in addition to x = y = 2,n = 1 or 3and in the presence of conventional free radical polymerization initiators, inhibitors, adhesion promoters, fillers or reinforcing fibers is cured.