首页> 外国专利> Substrate temperature measuring instrument with substrate heating method and heat treatment device - heats substrate by light, uses thermocouple with cover partly of high heat- and partly of high light-conductivity materials

Substrate temperature measuring instrument with substrate heating method and heat treatment device - heats substrate by light, uses thermocouple with cover partly of high heat- and partly of high light-conductivity materials

机译:具有衬底加热方法的衬底温度测量仪器和热处理装置-通过光加热衬底,使用热电偶,其盖子部分由高热而部分由高导电性材料制成

摘要

The instrument has a device for heating a substrate by light application and is composed of a thermocouple and a covering member over the thermocouple. The part of the covering member which covers temperature measuring part is made of a high heat-conductivity material. The part other than the part made of the high heat-conductivity material is made of high light-reflectivity material.
机译:该仪器具有用于通过光照射来加热基板的装置,并且由热电偶和热电偶上方的覆盖构件组成。覆盖构件的覆盖温度测量部的部分由高导热率的材料制成。除了由高导热率材料制成的部分之外的部分由高光反射率材料制成。

著录项

  • 公开/公告号DE19880398B4

    专利类型

  • 公开/公告日2008-09-04

    原文格式PDF

  • 申请/专利权人 SONY CORP.;MATTSON TECHNOLOGY INC.;

    申请/专利号DE1998180398

  • 发明设计人 YANAGAWA SYUSAKU;BLERSCH WERNER;

    申请日1998-02-26

  • 分类号G01K1/08;G01K1/16;H01L21/66;H01L21/324;

  • 国家 DE

  • 入库时间 2022-08-21 19:50:17

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