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A method for the application of coatings on band-shaped structures in the half conductor components manufacture and use of a device for the application of coatings on band-shaped structures
A method for the application of coatings on band-shaped structures in the half conductor components manufacture and use of a device for the application of coatings on band-shaped structures
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机译:在半导体组件中用于在带状结构上施加涂层的方法以及在带状结构上施加涂层的装置的使用
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摘要
A method for applying a coating on band-shaped structures (1), wherein the method has the following process steps:– The introduction of a band-shaped to be coated structure (1) in a first coating position (15), wherein the band-shaped structure has a flat conductor frame;– simultaneous selective coating a plurality of a periodically repeating pattern of the band-shaped structure (1) by means of a jet pressure process on a plurality of periodically recurring patterns on a top side (17) of the strip-shaped structure (1) with an adhesion-improving material, such surfaces of the pattern with the coating jet are to be printed on, which then are to be embedded in a plastics compound;– Transporting the to be coated, the band-shaped structure (1) into a second coating position (16);– simultaneous selective coating a plurality of a periodically repeating pattern of the band-shaped structure (1) by means of a jet pressure process on an underside (18) of the strip-shaped structure (1) with an adhesion-improving material, such surfaces of the pattern with the coating jet are to be printed on, which then are to be embedded in a plastics compound;– Removal of the two..
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