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A method for the application of coatings on band-shaped structures in the half conductor components manufacture and use of a device for the application of coatings on band-shaped structures

机译:在半导体组件中用于在带状结构上施加涂层的方法以及在带状结构上施加涂层的装置的使用

摘要

A method for applying a coating on band-shaped structures (1), wherein the method has the following process steps:– The introduction of a band-shaped to be coated structure (1) in a first coating position (15), wherein the band-shaped structure has a flat conductor frame;– simultaneous selective coating a plurality of a periodically repeating pattern of the band-shaped structure (1) by means of a jet pressure process on a plurality of periodically recurring patterns on a top side (17) of the strip-shaped structure (1) with an adhesion-improving material, such surfaces of the pattern with the coating jet are to be printed on, which then are to be embedded in a plastics compound;– Transporting the to be coated, the band-shaped structure (1) into a second coating position (16);– simultaneous selective coating a plurality of a periodically repeating pattern of the band-shaped structure (1) by means of a jet pressure process on an underside (18) of the strip-shaped structure (1) with an adhesion-improving material, such surfaces of the pattern with the coating jet are to be printed on, which then are to be embedded in a plastics compound;– Removal of the two..
机译:在带状结构上涂覆涂层的方法(1),其中该方法具有以下工艺步骤:–在第一涂覆位置(15)引入带状待涂覆结构(1),其中带状结构具有扁平的导体框架; –通过喷射压力工艺,在顶侧的多个周期性重复图案上同时选择性地涂覆带状结构(1)的多个周期性重复图案(17) )带有增强粘合力的条形结构(1)上,要印刷带有涂层射流的图案的此类表面,然后将其嵌入塑料混合物中; –运输待涂覆的涂层,将带状结构(1)置于第二涂覆位置(16); –通过喷射压力工艺在底面(18)上同时选择性地涂覆多个周期性重复的带状结构(1)图案带adh的条形结构(1)的结构增强材料,应在带有喷头的图案表面上进行印刷,然后将其嵌入塑料中; –去除两者。

著录项

  • 公开/公告号DE102004018483B4

    专利类型

  • 公开/公告日2007-11-29

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20041018483

  • 发明设计人

    申请日2004-04-14

  • 分类号H01L21/56;H01L21/312;B41F5/04;

  • 国家 DE

  • 入库时间 2022-08-21 19:50:08

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