首页> 外国专利> A process for the formation of side wall - distance structures and field effect transistors as well as structuring methods

A process for the formation of side wall - distance structures and field effect transistors as well as structuring methods

机译:侧壁-距离结构和场效应晶体管的形成工艺及其结构方法

摘要

A method of forming a a side wall - flu-spacer structure (5) and having by means of a substrate surface (10) of a semiconductor substrate (1) provided in the first structure (2), comprising:Providing a semiconductor substrate (1), comprising a first section, which consists of a first material;Formation of the first structure (2) with at least one to a substrate surface (10) of the semiconductor substrate vertical and in the first section, the tool side wall and a to the at least one side wall adjoining second portion made of a second material on the first section, wherein the second material, the growth of a from a gaseous precursor (8) preceding third material; andFeeding of the precursor (8), wherein the first, second and third material are so selected that the third material which grows selectively to the second section and the third material along the at least one vertical side wall extending side wall - flu-spacer structure (5) is formed which, in horizontal cross sections in height of the second portion has the same layer thickness.
机译:一种形成侧壁-流感间隔物结构(5)并借助于设置在第一结构(2)中的半导体衬底(1)的衬底表面(10)的方法,包括:提供半导体衬底(1)。 ),其包括由第一材料组成的第一部分;第一结构(2)的形成,该第一结构(2)垂直于半导体衬底的衬底表面(10),并且在第一部分中,工具侧壁和在第一部分上,由第二材料制成的至少一个侧壁邻接的第二部分,其中,第二材料由在第三材料之前的气态前体(8)生长。以及前体(8)的进料,其中选择第一,第二和第三材料,以使沿着至少一个垂直侧壁延伸的侧壁选择性地生长到第二部分的第三材料和第三材料形成(5),其在第二部分的高度的水平截面中具有相同的层厚度。

著录项

  • 公开/公告号DE102006023607B4

    专利类型

  • 公开/公告日2008-10-16

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20061023607

  • 发明设计人

    申请日2006-05-19

  • 分类号H01L21/336;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:58

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